Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Standard - DDR2 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-103. |
GS-007-A | Jun 2007 |
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Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315. |
MS-017-B | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S. |
MS-032-A | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S. |
MS-031-A | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S. |
MS-030-A | |
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Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S. |
MS-033-A | |
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Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA. |
MS-034G | Jan 2017 |
Item No. 11.11-933 (S) Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Free download. Registration or login required. |
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Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s. |
MS-028-C | |
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Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH. |
MS-005-A | |
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Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH. |
MS-003-A | |
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