Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
DDR5 SODIMM Raw Card Annex E |
JESD309-S4-RCE | Jun 2022 |
This annex JESD309-S4-RCE, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex C Version 1 |
JESD309-S0-RCC | Jun 2022 |
This annex JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex A Version 1 |
JESD309-S0-RCA | Jun 2022 |
This annex JESD309-S0-RCA, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex D Version 1.0 |
JESD309-S4-RCD | Jun 2022 |
This annex JESD309-S4-RCD, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex defines the design detail of x8, 1 Package Rank DDR5 SODIMM with 4-bit ECC. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Committee(s): JC-45.3 Free download. Registration or login required. |
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JEDEC COMMITTEE SPECIFIC ADDITIONAL POLICIES |
JM12B | Jun 2022 |
In some cases, JEDEC Committees have established additional policies and guidelines to facilitate the operation of a particular committee. Additional policies and guidelines are set forth here as an addendum to JM21 to facilitate the operation of particular committees. These policies are in addition to the requirements set forth in JM21 and in no case shall these additions contradict or supersede the requirements in JM21. Committee(s): JC-JEDC Free download. Registration or login required. |
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SOLID-STATE DRIVE (SSD) ENDURANCE WORKLOADS |
JESD219A.01 | Jun 2022 |
Terminology update, see Annex. This standard defines workloads for the endurance rating and endurance verification of SSD application classes. These workloads shall be used in conjunction with the Solid State Drive (SSD) Requirements and Endurance Test Method standard, JESD218. Also see JESD219A_MT and JESD219A_TT for the supporting trace files. Free download. Registration or login required. |
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DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard |
JESD309 | May 2022 |
This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM SODIMMs). These DDR5 SODIMMs are intended for use as main memory when installed in Computers, laptops and other systems. Item 2262.06B Free download. Registration or login required. |
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EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NONVOLATILE MEMORY DEVICES |
JESD251C | May 2022 |
This standard specifies the eXpanded Serial Peripheral Interface (xSPI) for Non Volatile Memory Devices, which provides high data throughput, low signal count, and limited backward compatibility with legacy Serial Peripheral Interface (SPI) devices. It is primarily for use in computing, automotive, Internet Of Things (IOT), embedded systems and mobile systems, between host processing and peripheral devices. The xSPI electrical interface can deliver up to 400 MBytes per second raw data throughput. Item 1775.74. Committee(s): JC-42.4 Free download. Registration or login required. |
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Definition of the EE1002 and EE1002A Serial Presence Detect (SPD) EEPROMs |
SPD4.1.3-01 | May 2022 |
Release No. 19.01. Item 1739.02E, Terminology update. This standard defines the specifications of interface parameters, signaling protocols, and features for Serial Presence Detect (SPD) EEPROMs as used for memory module applications. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Mobile Platform Memory Module Thermal Sensor Component Specification |
MODULE4.7 | May 2022 |
Release No. 16. This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents (Release 15, Item 1640.07) Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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