Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S |
MS-029-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s. |
MS-028-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S. |
MS-031-A | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S. |
MS-030-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S. |
MS-033-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S. |
MS-032-A | |
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Standard Practices and Procedures - Document Procedure. |
SPP-001 | |
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Standard Practices and Procedures - Pin #1 Mark Function and Location. |
SPP-002 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Lead Finish and base Metal Specification. |
SPP-004 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 orientation for TAB Packages. |
SPP-005 | |
Committee(s): JC-11 Free download. Registration or login required. |
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