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Title	Document #	Date
Byte Wide ECL SRAM	SRAM3.7.6	Jul 1997
Release No. 9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide EEPROM	EEPROM3.5.1	Aug 2005
Release No. 14 Committee(s): JC-42.4, JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide MPDRAM	MPDRAM3.10.2	Jun 1997
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide PROM	PROM3.3.2	Dec 1993
Release No.1 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide ROM	ROM3.2.1	Dec 1992
Release No.2 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide SDRAM	SDRAM3.11.3	Jan 2004
Release No.13 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide SRAM	SRAM3.7.5	Apr 2003
Release No.12 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES - SUPERSEDED BY JESD9B, May 2011. Status: Rescinded, May 2011	JESD27	Aug 1993
The intent of this standard is to be a guide in the manufacture and procurement of ceramic packages, especially for the hybrid industry. Manufacturers or ceramic packages and procuring activities for these packages will now be able to use this document as the means for agreement in the imposition of minimum requirements in qualification, screening, and quality conformance. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPERATURES Status: Reaffirmed September 2019	JEP153A	Mar 2014
This document provides an industry standard method for characterization and monitoring thermal stress test oven temperatures. The procedures described in this document should be used to insure thermal stress test conditions are being achieved and maintained during various test procedures. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES	JEP167A	Nov 2020
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle. Committee(s): JC-14.1 Free download. Registration or login required.

Standards & Documents Search

Byte Wide ECL SRAM

Byte Wide EEPROM

Byte Wide MPDRAM

Byte Wide PROM

Byte Wide ROM

Byte Wide SDRAM

Byte Wide SRAM

CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES - SUPERSEDED BY JESD9B, May 2011.

CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPERATURES

CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES

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