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Title	Document #	Date
DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card A Annex Release Number: Version 1.1	JESD309-S0-RCA	Mar 2025
This annex, JESD309-S0-RCA, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card A Annex, defines the design detail of x8, 1 Package Rank DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.3 Free download. Registration or login required.
DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex Release Number: Version 1.1	JESD309-S4-RCD	Mar 2025
This annex, JESD309-S4-RCD, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex, defines the design detail of x8, 1 Package Rank DDR5 SODIMM with 4-bit ECC. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.3 Free download. Registration or login required.
DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card C Annex Release Number: Version 1.1	JESD309-S0-RCC	Mar 2025
This annex, JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card C Annex, defines the design detail of x16, 1 Package Ranks DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.3 Free download. Registration or login required.
DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex Release Number: Version 1.1	JESD309-S4-RCE	Mar 2025
This annex, JESD309-S4-RCD, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex, defines the design detail of x8, 1 Package Rank DDR5 SODIMM with 4-bit ECC. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.3 Free download. Registration or login required.
JEDEC Manual of Organization and Procedure	JM21W	Mar 2025
This Manual sets forth the mission and requirements of JEDEC as an independent incorporated Association governed by a Board of Directors. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-BOD Free download. Registration or login required.
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 7th Edition	JESD88G	Mar 2025
This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available. It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions. The long-term goal is to include definitions from all JEDEC publications and standards. Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included. All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-10 Free download. Registration or login required.
PMIC5020 Power Management IC Standard Release Number: Version 1.1	JESD301-4A	Mar 2025
This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5020 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5020 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40, JC-40.1 Free download. Registration or login required.
High Bandwidth Memory (HBM3) DRAM	JESD238B.01	Apr 2025
The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR). A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.2 Free download. Registration or login required.
SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE (HBM4)	MO-362B	Apr 2025
Designator: SBGA-M8236[56028]_I0p65-R14p175x10p975Z0p81 Item #: 4-1079 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
High Bandwidth Memory (HBM4) DRAM	JESD270-4	Apr 2025
The HBM4 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM4 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR). The JESD271-4 HBM4 Bump Matrix Spreadsheet will be available in early May. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.2 Free download. Registration or login required.

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