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DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A Annex

Release Number: Version 1.00 		JESD323-A0-RCA Nov 2024

This standard, JESD323-A0-RCA, “DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A Annex” defines the design detail of x8, 1 Package Rank DDR5 NECC CUDIMM with Clock Driver.

Committee(s): JC-45, JC-45.3

Free download. Registration or required.

DDR5 Clocked Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 CSODIMM) Raw Card D Annex

Release Number: Version 1.00 		JESD324-W4-RCD Nov 2024

This standard, JESD324-W4-RCD, “DDR5 Clocked Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 CSODIMM) Raw Card D Annex” defines the design detail of x8, 1 Package Ranks DDR5 CSODIMM with Clock Driver.

Committee(s): JC-45.3

Free download. Registration or required.

PART MODEL SCHEMAS

 JEP30-10v7-0-0 Nov 2024

This download includes all files under the parent schema JEP30-10v7-0-0 (Committees: JC-11, JC-11.2) including:

  • JEP30-A101v2-0-3 (Assembly Process),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-E101v4-1-0 (Electrical),
    • Committees: JC-11, JC-11.2, JC-16
  • JEP30-P101v7-0-0 (Package),
    • Committees: JC-11, JC-11.2
  • JEP30-S101v1-1-0 (Supply Chain),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-T101v2-0-3 (Thermal)
    • Committees: JC-11, JC-11.2, JC-15
  • JEP30-D10v4-0-0 (Types Dictionary)
    • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

Free download. Registration or required.

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-S100A.01 Nov 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-P100F Nov 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-E100F Nov 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-16

Free download. Registration or required.

Descriptive Designation System for Electronic-device Packages and Footprints

JESD30N Nov 2024

This standard establishes requirements for the generation of electronic-device package designators for JEDEC.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Raw Card C Annex

Release Number: Version 1.00 		JESD324-V0-RCC Nov 2024

This standard, JESD324-V0-RCC, "DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) RawCard C Annex" defines the design detail of x16, 1 Package Ranks DDR5 CSODIMM with Clock Driver.

Committee(s): JC-45.3

Free download. Registration or required.

Serial Flash Discoverable Parameters (SFDP)

 JESD216G Nov 2024

The SFDP standard defines the structure of the SFDP database within the memory device and methods used to read its data.

Committee(s): JC-42.4

Free download. Registration or required.

Low Power Double Data Rate Interface for Non-Volatile Memory (LPDDR4X-NVM) Standard

 JESD326-4 Nov 2024

This standard defines the Low Power Double Data Rate interface for Non-Volatile Memory (LPDDR4XNVM) Standard. This standard describes features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements

for a JEDEC compliant 16 bit single channel LPDDR4X-NVM device. LPDDR4X-NVM density ranges from 128Mb through 32Gb.

Committee(s): JC-42, JC-42.6

Free download. Registration or required.

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