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Title	Document #	Date
A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces	JEP196	Nov 2023
This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema	JEP181_Schema_R2p0	Nov 2023
In conjunction with JEP181A, for user support this file is the entire “XML Requirements Schema”. Committee(s): JC-15 Free download. Registration or login required.
ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements	JEP181A	Nov 2023
This publication establishes the requirements for the exchange of electronic thermal system level simulation models between supplier and end user in a single neutral file format. Committee(s): JC-15 Free download. Registration or login required.
JEDEC Manual of Organization and Procedure	JM21V	Nov 2023
This Manual sets forth the mission and requirements of JEDEC as an independent incorporated Association governed by a Board of Directors. Committee(s): JC-BOD Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v4-0-0	Nov 2023
This download includes all files under the parent schema JEP30-10v4-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-1 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v3-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v4-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-0-1 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-1 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v3-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM	DR-4.5O	Nov 2023
BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM Item 2-1038 Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100C	Nov 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100C	Nov 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30C	Nov 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Registration - PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)	SO-032B	Nov 2023
Designator: SO-032B_PDUtBXC-H644_I1p0-R17p15x78p0Z1p05 Item: 14-222 Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements

JEDEC Manual of Organization and Procedure

PART MODEL SCHEMAS

Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

Part Model Guidelines for Electronic-Device Packages – XML Requirements

Registration - PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)

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