Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272. |
MO-105-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403. |
MO-173-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |
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Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E). |
TO-278B | Nov 2006 |
Patents(): STMicroelectronics Inc. Free download. Registration or login required. |
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Registration - Thin Matrix Tray for Shipping and Handling of Ball Grid Packages. Includes Change to Note 18. Item 11.5-633 |
CO-029-H | Sep 2002 |
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Free download. Registration or login required. |
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Registration - Thin Matrix Tray for Handling and Shipping Small Outline J- Lead Packages (SOJ). Item 11.5-446. |
CO-032-A | Jun 1996 |
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Free download. Registration or login required. |
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Registration - Thin Matrix Tray for Advanced Memory Buffer. Item 11.5-736. |
CO-035A | Mar 2006 |
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Free download. Registration or login required. |
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Registration - Thin Matrix Mini Tray for Shipping and Handling. Item 11.5-427. |
CO-030-A | Oct 1995 |
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Free download. Registration or login required. |
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Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318. |
MO-122-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA |
MO-308A | Apr 2012 |
Item 11.11-853 Free download. Registration or login required. |
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