Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Registration - Update of AC Configuration - Leadless Family. Item 11.10-240. |
DO-213-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492. |
MO-194-B | |
Free download. Registration or login required. |
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Registration - TSOP I, 7.62 mm Body. Item 11.11-346. |
MO-132-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426. |
MO-183-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Tray for Handling and Shipping of PQFP Packages, 52, 68, 84, 100, 132, 164, 196 and 244 Pins. Variations AA-AG. Item 11.5-249 |
CO-015-B | Jan 1993 |
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Free download. Registration or login required. |
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Registration - Tray for Handling and Shipping of PGA Packages. Item 11.5-382 |
CO-010-E | Nov 1994 |
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Free download. Registration or login required. |
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Registration - Tray for Handling and Shipping of Metric Quad Flatpack (QFP) Packages. Variations AA-AE. Item 11.5-298/336. |
CO-012-C | Nov 1992 |
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Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264. |
MO-090-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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