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Title	Document #	Date
Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.	MO-179-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357	MO-114-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM	MO-309F	Mar 2015
Item No. 11.14-176 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH	MO-314A.02	Jul 2016
Item 14-183, Minor Editorial Revision Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309.	TO-265-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3-Tier Family. PQFP-B. Item 11.11-473.	MO-198-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009.	MO-064-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly	MO-347A	Mar 2021
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1 Item: 11.11-987, Access STP Files for MO-347A Cross Reference: N/A Patents(): Kioxia: 1705380 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF	MO-312A	Feb 2013
Item No. 11-875 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 4 Lead Quad Flat Pack (QFP).	TO-271-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.

Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357

Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM

Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH

Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309.

Registration - 3-Tier Family. PQFP-B. Item 11.11-473.

Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009.

Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly

Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF

Registration - 4 Lead Quad Flat Pack (QFP).

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