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Title	Document #	Date
Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.	MO-278A	Sep 2006
Item 11.14-092 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787	MO-253-B	Feb 2008
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.	MO-190-D	Jan 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.	MO-062-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.	MO-138-A	Jun 1993
Item 11.10-310 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311.	MO-139-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027.	MO-191-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 168 pin DIMM. Multiple Keyway Dual-In-Line Memory Module (DIMM), 1.27 mm contact centers. Addition of the 100 pin variation GA-XX and the INACTIVATION of the 168 pin right polarized configuration to DIMM registration. Item 11.14-055/056.	MO-161-F	Dec 2002
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312.	MO-140-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 2 and 4 Lead Surface Mount Power Package. (H,HB1)-PDSO, (H,HB1)-PSOF. Item 11.10-446.	TO-270C	Jul 2008
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.

Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787

Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.

Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.

Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.

Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311.

Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027.

Registration - 168 pin DIMM. Multiple Keyway Dual-In-Line Memory Module (DIMM), 1.27 mm contact centers. Addition of the 100 pin variation GA-XX and the INACTIVATION of the 168 pin right polarized configuration to DIMM registration. Item 11.14-055/056.

Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312.

Registration - 2 and 4 Lead Surface Mount Power Package. (H,HB1)-PDSO, (H,HB1)-PSOF. Item 11.10-446.

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