Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Bit Wide ECL SRAM |
SRAM3.7.2 | Jul 1997 |
Release No. 9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Bit Wide SDRAM |
SDRAM3.11.1 | Jun 1997 |
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Bit Wide TTL SRAM |
SRAM3.7.1 | Dec 1995 |
Release No. 5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICs FOR HANDHELD ELECTRONIC PRODUCTS |
JESD22-B113B | Aug 2018 |
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly. Free download. Registration or login required. |
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Board Level Drop Test Method of Components for Handheld Electronic Products |
JESD22-B111A.01 | Jun 2024 |
This Test Method standardizes the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components. Free download. Registration or login required. |
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BOND WIRE MODELING STANDARD: |
JESD59 | Jun 1997 |
This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration. Committee(s): JC-15.2 Free download. Registration or login required. |
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BUS INTERCONNECT LOGIC (BIC) FOR 1.2 V |
JESD8-16A | Nov 2004 |
This standard defines the electrical parameters for high-speed interfaces for use in the 1.2V electrical environment. Included in the standard are a single ended signaling interface suitable for parallel buses, and a differential signaling interface suitable for clock applications or parallel differential buses. JEDEC BIC Standard JESD8-16A continues the tradition of the JESD8-xx standards, defining electrical interfaces for the industry as new technologies and bus requirements develop. Previously, JEDEC defined standard JESD8-6, the HSTL standard, for use in 1.5V electrical environments. BIC is similar to HSTL, except the power supply voltage has dropped from 1.5V to 1.2V, and interface requirements are tightened to allow much higher speeds Committee(s): JC-16 Free download. Registration or login required. |
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BYTE ADDRESSABLE ENERGY BACKED INTERFACE |
JESD245E | Apr 2022 |
This standard specifies the host and device interface for a DDR4 NVDIMM-N, which is a DIMM that achieves non-volatility by copying SDRAM contents into non-volatile memory (NVM) when host power is lost using an Energy Source managed by either the module or the host. This standard is used in conjunction with JESD248. Item 2233.54G Committee(s): JC-45.6 Free download. Registration or login required. |
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Byte Wide |
EPROM3.4.1 | Jul 1997 |
Release No.9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Byte Wide DRAM |
DRAM3.9.3 | Jun 1999 |
Release No. 9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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