Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Wire Bond Pull Test Methods |
JESD22-B120.01 | Sep 2024 |
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Free download. Registration or login required. |
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WIRE BOND SHEAR TEST |
JESD22-B116B | May 2017 |
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. Pictures have been added to enhance the fail mode diagrams. The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. It is appropriate for use in process development, process control and/or quality assurance. Free download. Registration or login required. |
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WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)Status: SupersededAugust 2016 (11.2-924) |
SPP-020A | Jul 2003 |
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 Free download. Registration or login required. |
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Word Wide DRAM |
DRAM3.9.4 | Jul 2000 |
Release No. 10 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide EPROM |
EPROM3.4.2 | Jun 1999 |
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide Graphics DRAM |
MPDRAM3.10.3 | Jan 2004 |
Release No.13 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide PROM, DIP to SO Conversion |
PROM3.3.3-4 | Dec 1993 |
Release No.1 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide ROM |
ROM3.2.2 | Dec 1992 |
Release No.6 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide SDRAM. |
SDRAM3.11.4 | Feb 2008 |
Release No. 17. Item 1749.01 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide TTL and MOS SRAM |
SRAM3.7.7 | Apr 2007 |
Release No. 16. Item 1541.03 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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