Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
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THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)- SUPERSEDED BY JESD51-4, September 1997.Status: ElevatedSeptember 1997 |
JEP129 | Feb 1997 |
Committee(s): JC-15.1 Free download. Registration or login required. |
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THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES |
JESD51-31 | Jul 2008 |
This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared. Committee(s): JC-15 Free download. Registration or login required. |
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TRANSIENT DUAL INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW THROUGH A SINGLE PATH |
JESD51-14 | Nov 2010 |
This document specifies a test method (referred to herein as “Transient Dual Interface Measurement”) to determine the conductive thermal resistance “Junction-to-Case” RθJC (θJC) of semiconductor devices with a heat flow through a single path, i.e., semiconductor devices with a high conductive heat flow path from the die surface that is heated to a package case surface that can be cooled by contacting it to an external heat sink. TDIM Master Software: TDIM-Master-2011-04-06.zip
Committee(s): JC-15 Free download. Registration or login required. |
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TRANSIENT VOLTAGE SUPPRESSOR STANDARD FOR THYRISTOR SURGE PROTECTIVE DEVICE:Status: ReaffirmedNovember 2006 |
JESD66 | Nov 1999 |
This standard is applicable to Thyristor Surge Protective Devices. It describes terms and definitions and explains methods for verifying device ratings and measuring device characteristics. The intended users of this standard are those interested in Thyristor Surge Protective Device characterization and rating verification. These devices are used primarily by the telecommunications industry to protect circuits from harmful overvoltages. The Thyristor Surge Protective Device (TSPD) is a semiconductor device that is finding widespread application in the telecommunication industry. The intent of this stand is to provide information on test methods that will reduce the possibility of disagreement and misunderstanding between TSPD vendors and users, and facilitate the determination of device interchangeability. Committee(s): JC-22.5 Free download. Registration or login required. |
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TRANSISTOR, GALLIUM ARSENIDE POWER FET, GENERIC SPECIFICATION:Status: Rescinded |
JES2 | Jul 1992 |
Establishes guideline requirements and quality assurance provisions for gallium arsenide power field-effect transistors (FETs, also know as MESFETs) designed for use in high-reliability space application such as spacecraft communications transmitters. Identifies the electrical parameters, wafer acceptance tests, screening tests, qualification tests, and lot acceptance tests pertinent to power GaAs FETs. Applicable to packaged and chip-carrier parts; portions may not be applicable to unpackaged and unmounted chips. **This document was rescinded on October 17, 2024, but is available for download for reference. purposes. Committee(s): JC-14.7 Free download. Registration or login required. |
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TS3000 Standalone Thermal Sensor Component |
SPD4.1.5 | Nov 2009 |
Release No. 19A, Item 1640.11 Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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TS511X, TS521X Serial Bus Thermal Sensor Device Standard |
JESD302-1A | Aug 2023 |
This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device operate on I2C and I3C two-wire serial bus interface. The designation TS521X and TS511X refers to the device specified by this document. Committee(s): JC-40.1 Free download. Registration or login required. |
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TSE2002 Serial Presence Detect with Thermal Sensor |
PRN09-NV2 | Jul 2009 |
Preliminary publication of BoD-approved ballot material, prior to its inclusion in the next release of the appropriate JEDEC Standard. Item 1756.00A Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Two Byte Modules Cards |
MODULE4.3 | Jun 1997 |
Release No.9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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TWO-RESISTOR COMPACT THERMAL MODEL GUIDELINE |
JESD15-3 | Jul 2008 |
This document specifies the definition and construction of a two-resistor compact thermal model (CTM) from the JEDEC junction-to-case and junction-to-board thermal metrics. The guidance provided in this document only applies to thermal metrics defined in JEDEC standards JESD51-8 and JESD51-12. The scope of this document is limited to single-die packages that can be effectively represented by a single junction temperature. Committee(s): JC-15 Free download. Registration or login required. |
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