Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-M100 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model Free download. Registration or login required. |
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PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-K100 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model. Free download. Registration or login required. |
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Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-S100A.02 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100G | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required. |
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Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-A100B.01 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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Descriptive Designation System for Electronic-device Packages and Footprints |
JESD30O | Feb 2025 |
This standard establishes requirements for the generation of electronic-device package designators for JEDEC. Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE |
MS-012H | Feb 2025 |
Designator: PDSO-G#_I127-##... Item 11-1061 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP) |
MO-366A | Feb 2025 |
Designator: PBGA-B#[#]_I0p35... Item: 11-1075
Free download. Registration or login required. |
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PMIC5000/PMIC5010 Power Management IC Standard |
JESD301-1A.03 | Feb 2025 |
This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5000, PMIC5010 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5000, PMIC5010 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This is a minor update to correct the document name, and also remove the extraneous hard return in the middle of the description between “as” and “used”. Committee(s): JC-40.1 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, 1.27 MM PITCH, 7.50 MM BODY WIDTH, RECT FAMILY PACKAGE |
MS-013H | Feb 2025 |
Designator: PDSO-G#-I1p27... Item 11-1062 Free download. Registration or login required. |