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Title	Document #	Date
JEDEC® Memory Device Management Standard – for Compute Express Link® (CXL®)	JESD325	Sep 2024
This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. It is intended to target, but may not be limited to, CXL memory FRUs that are based on PCIe Gen 5 and compliant to the CXL 2.0 Specification or later. Committee(s): JC-40, JC-45 Free download. Registration or login required.
DDR5 SERIAL PRESENCE DETECT (SPD) CONTENTS Release Number: Release 1.3	JESD400-5C	Sep 2024
This standard describes the serial presence detect (SPD) values for all DDR5 memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be use by the system's BIOS in order to properly initialize and optimize the system memory channels. Committee(s): JC-45 Free download. Registration or login required.
Temperature Range and Measurement Standards for Components and Modules	JESD402-1B	Sep 2024
This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications. Committee(s): JC-42 Free download. Registration or login required.
PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR)	TO-283A	Sep 2024
Item #11-1060 Package Designator: PDFM-E5_I2p0.... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing (Wafer Fabrication Manufacturing Sites)	JEP001-3B	Sep 2024
The publication provides methodologies for measurements to qualify a new semiconductor wafer process. Committee(s): JC-14, JC-14.2 Free download. Registration or login required.
PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE	MO-354B	Sep 2024
Item: 11-1065 Designator: PMSO-E#_I1p14-... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE	MO-216H	Sep 2024
Designator: PBGA-B#[#]_I80... Item: 11-1064 Cross Reference: DR4.5 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements	JEP30-A100B	Aug 2024
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30E	Aug 2024
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE	MO-153I	Aug 2024
Package Designator: PDSO-G#-I##.... Item# - JC11.11-1069 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

JEDEC® Memory Device Management Standard – for Compute Express Link® (CXL®)

DDR5 SERIAL PRESENCE DETECT (SPD) CONTENTS

Temperature Range and Measurement Standards for Components and Modules

PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR)

Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing (Wafer Fabrication Manufacturing Sites)

PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE

PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

Part Model Guidelines for Electronic-Device Packages – XML Requirements

PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE

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