Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # | Date |
|---|---|---|
CLASSIFICATION OF PASSIVE AND SOLID STATE DEVICES FOR ASSEMBLY PROCESSES |
J-STD-075A | May 2018 |
This is a Joint Standard between ECIA, IPC, and JEDEC. The purpose of this specification is to establish an agreed to set of worst case solder assembly process conditions to which devices are evaluated. The generated PSL rating will convey the conditions to which a device can be safely attached to FR4 type or ceramic laminates using SMT reflow and solder wave/fountain soldering processes. It is important for device manufacturers (hereafter referred to as “suppliers”), users, and (PWB) assemblers to be highly familiar with this standard’s information and processes to insure optimal device quality and reliability. THIS DOCUMENT IS NOT AVAILABLE FOR FREE DOWNLOAD. However, this document is available to the JEDEC formulating Committee members on the JC-14 Resources tab on the Members' website. The lead organization is ECIA. Committee(s): JC-14 |
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JOINT IPC/JEDEC Standard Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs) |
J-STD-020F | Dec 2022 |
The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. Free download. Registration or login required. |
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JOINT JEDEC/IPC/ECIA STANDARD - NOTIFICATION STANDARD FOR PRODUCT DISCONTINUANCE |
J-STD-048 | Nov 2014 |
This document supersedes JESD48. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned product discontinuance, which will assist customers in managing end-of-life supply, or to transition ongoing requirements to alternate products. Committee(s): JC-14.4 Free download. Registration or login required. |
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SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES:Removed 01/21/04 Release Number: B |
J-STD-002 | Feb 2003 |
At the request of IPC, J-STD-002B has been removed from the free download area. In its place, JEDEC's Test Method, JESD22-B102, Solderability, which includes lead-free, was made available until it was replaced by J-STD-002D.
Any revision to J-STD-002 will no longer be available for free to the industry on the JEDEC website. However, the document is available to the JEDEC formulating Committee members, in the Members Area.
If you are not a JEDEC member you may wish to try the IPC website or one of the resellers listed at: http://www.jedec.org/standards-document |
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Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly |
J-STD-609C.01 | Apr 2024 |
This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes, and it describes the marking and labeling of their shipping containers to identify their 2nd level terminal finish or material. Free download. Registration or login required. |
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CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS CHANGES BY ELECTRONIC PRODUCT SUPPLIERS |
J-STD-046 | Jul 2016 |
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee(s): JC-14.4 Free download. Registration or login required. |
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ADDENDUM No. 1 to EIA-318 - CHARACTERIZATION OF A REVERSE TEST FIXTURE: SUPERSEDED BY EIA-318-B, July 1996.Status: Rescinded |
EIA318-1 | Feb 1981 |
Committee(s): JC-22.4 Free download. Registration or login required. |
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MEASUREMENT OF REVERSE RECOVERY TIME FOR SEMICONDUCTOR SIGNAL DIODES:Status: Reaffirmed |
EIA318-B | Jul 1996 |
This standard describes the measurement of signal diodes (IF <=500mA dc) reverse recovery times of less than 300 ns duration. It may, however, also be used for the measurement of longer recovery times. This standard is also intended to establish a method which to characterize the test fixture used for this measurement. Committee(s): JC-22.4 Free download. Registration or login required. |
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AIR-CONVECTION-COOLED, LIFE TEST ENVIRONMENT FOR LEAD-MOUNTED SEMICONDUCTOR DEVICES:Status: ReaffirmedFebruary 1972, November 2002 |
EIA323 | Mar 1966 |
This standard is applicable to life testing of lead-mounted semiconductor devices intended for applications in a natural air-cooled environment where most of the power dissipation is obtained by convection and radiation losses from the body to the device. Committee(s): JC-22.1 Free download. Registration or login required. |
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PERFORMANCE TEST PROCEDURE FOR SOLAR CELLS AND CALIBRATION PROCEDURE FOR SOLAR CELL STANDARDS FOR SPACE VEHICLE SERVICE:Status: ReaffirmedFebruary 1984 |
EIA365 | Nov 1969 |
The purpose of this standard is to classify the output of solar cells for space vehicle service in accordance with requirements of EIA Format JS4-RDF4. Committee(s): JC-23.1 Free download. Registration or login required. |
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