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Title	Document #	Date
A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces	JEP196	Nov 2023
This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices	JEP197	Nov 2023
This publication provides guidance to SiC product suppliers and related power electronic industries in their evaluation of bipolar degradation mechanism in SiC power devices. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices	JEP198	Nov 2023
This publication presents guidelines for evaluating the Time Dependent Breakdown (TDB) reliability of GaN power switches. Committee(s): JC-70, JC-70.1 Free download. Registration or login required.
Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors	JEP199	Apr 2024
This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors. Committee(s): JC-14, JC-14.2 Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v7-0-0	Nov 2024
This download includes all files under the parent schema JEP30-10v7-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-3 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v4-1-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v7-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-1-0 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-3 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v4-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices Volume 1	JEP200	Jun 2024
This document provides guidelines for test methods and circuits to be used for measuring switching energy loss due to output capacitance hysteresis in semiconductor power devices. Committee(s): JC-70, JC-70.1, JC-70.2 Free download. Registration or login required.
Guidelines for Reverse Recovery Time and Charge Measurement of SiC MOSFET Version 1.0	JEP201	Aug 2024
This guideline is intended to overcome the limitations of prior standards and provide a test circuit and method that provides both reliable and repeatable results. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
Guidelines for Representing Threshold Voltage of SiC MOSFETs in Datasheets, Version 1.0 Release Number: Version 1.0	JEP202	Jan 2025
This publication provides guidelines for representation of threshold voltage and transfer characteristic of SiC MOS device in datasheets. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
JOINT IPC/JEDEC Standard for Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices	J-STD-035A	Dec 2022
This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES	J-STD-033D	Apr 2018
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

Standards & Documents Search

A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces

Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices

Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices

Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors

PART MODEL SCHEMAS

Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices Volume 1

Guidelines for Reverse Recovery Time and Charge Measurement of SiC MOSFET Version 1.0

Guidelines for Representing Threshold Voltage of SiC MOSFETs in Datasheets, Version 1.0

JOINT IPC/JEDEC Standard for Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices

JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

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