Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN. |
DG-4.23A | Nov 2005 |
Item 11.2-728(S) Free download. Registration or login required. |
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Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN. |
MO-263-A | Sep 2005 |
Item 11.11-734 Free download. Registration or login required. |
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Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN. |
MO-262-A | Sep 2005 |
Item 11.11-733 Free download. Registration or login required. |
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Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.This document is being removed based on decission by the Chair under directive from the BoD, letter is attached |
MO-220-D | Feb 2002 |
This registration has been removed. Please 'open file' for more information regarding this issue. Free download. Registration or login required. |
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Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631. |
MO-211-C | Jun 2004 |
Committee(s): JC-11.4 Free download. Registration or login required. |