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Displaying 1 - 18 of 18 documents. Show 5 | 10 results per page.

Title	Document #	Date
Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439.	DO-222A	May 2006
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.	MO-211-C	Jun 2004
Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.	MO-241-B	Aug 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.	MO-250-A	Nov 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.	MO-298-A	Jun 2009
Item 11.11-816 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.	MO-294-A	Nov 2008
Item 11.11-804 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.	MO-291-B	Dec 2008
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.	MO-285-A	Aug 2007
Item 11.11-760 and 11.11-760(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.	MO-265-A	Nov 2005
Item 11.11-722 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.	MO-263-A	Sep 2005
Item 11.11-734 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.	MO-262-A	Sep 2005
Item 11.11-733 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.	MO-225-C	Aug 2007
Item 11.11-761 and 11.11-761(E). Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.	MO-267-B	Feb 2006
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN.	DG-4.23A	Nov 2005
Item 11.2-728(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP.	MO-292C	Apr 2010
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.	MO-187-F	Sep 2010
Item 11.11-832 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620. This document is being removed based on decission by the Chair under directive from the BoD, letter is attached	MO-220-D	Feb 2002
This registration has been removed. Please 'open file' for more information regarding this issue. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA. Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326	MO-266C	Jan 2009
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 JEP95 Registrations Main Page

Standards & Documents Search

Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439.

Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.

Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.

Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.

Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.

Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.

Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.

Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.

Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.

Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.

Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN.

Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP.

Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.

Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.

Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.

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