Global Standards for the Microelectronics Industry
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Displaying 1 - 8 of 8 documents. Show 5 results per page.
Title | Document # | Date |
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UNIVERSAL FLASH STORAGE (UFS) TEST |
JESD224A | Jul 2017 |
The primary objective of this test standard is to specify the test cases for UFS device protocol conformance testing. This test standard provides test cases for checking the functions defined in the following target standard: JESD220. Universal Flash Storage (UFS) Standard version 1.1A. MIPI M-PHY and MIPI UniPro test cases are not in the scope of this document. Item 400.36 Committee(s): JC-64.5 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS), Version 3.0Status: Superseded January 2020 |
JESD220D | Jan 2018 |
This document has been superseded by JESD220E, January 2020, however is available for reference only. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64.1 Available for purchase: $355.00 Add to Cart Paying JEDEC Members may login for free access. |
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UNIVERSAL FLASH STORAGE HOST CONTROLLER INTERFACE (UFSHCI), Version 3.0Status: Superseded August 2022 by JESD223E |
JESD223D | Jan 2018 |
This document has been superseded by JESD223E, however it is available for reference only. Committee(s): JC-64.1 Available for purchase: $141.00 Add to Cart Paying JEDEC Members may login for free access. |
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MCP and Discrete e•MMC, e•2MMC, and UFSRelease Number: 33 |
MCP3.12.1-1 | Jun 2024 |
Item 142.12 This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution.
Committee(s): JC-64.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS), Version 3.1 |
JESD220E | Jan 2020 |
This document has been superseded by JESD220F, August 2022, however is available for reference only. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64.1 Available for purchase: $355.00 Add to Cart Paying JEDEC Members may login for free access. |
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UNIVERSAL FLASH STORAGE, Version 4.0 |
JESD220F | Aug 2022 |
This document replaces all past versions, however JESD220E, January 2020 (V 3.1), is available for reference only. This standard specifies the characteristics of the UFS electrical interface and the memory device. Such characteristics include (among others) low power consumption, high data throughput, low electromagnetic interference and optimization for mass memory subsystem efficiency. The UFS electrical interface is based on an advanced differential interface by MIPI M-PHY specification which together with the MIPI UniPro specification forms the interconnect of the UFS interface. Committee(s): JC-64.1 Available for purchase: $369.00 Add to Cart Paying JEDEC Members may login for free access. |
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Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension |
JESD220-4 Version 1.01 | Nov 2023 |
This standard specifies the extension specification of the UFS electrical interface and the memory device. PLEASE NOTE: Revision and renumbering of JESD231 Version 1.0, August 2022 Free download. Registration or login required. |
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Zoned Storage for UFS |
JESD220-5 | Nov 2023 |
The purpose of this standard is to describe Zoned Storage for UFS, which enables higher bandwidth, lower latency and to reduce write amplification. Patents(): Huawei 201911209032.1; 116166570,A Memory Technologies LLC 101952808 104657284 2248023 3493067 602009056490.0 602009064847.0 HK1210296 5663720 6602823 10-1281326 10-1468824 2248023 3493067 2248023 3493067 8307180 8601228 9063850 9367486 10540094 11550476 Free download. Registration or login required. |