Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 3 of 3 documents.
Title | Document # | Date |
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Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E). |
TO-278B | Nov 2006 |
Patents(): STMicroelectronics Inc. Free download. Registration or login required. |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |