Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |
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Design Requirements - Thin Small Outline Package, TSOP - Type 2. |
DG-4.15B | May 2004 |
Item 11.2-675(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.65 MM Pitch Rectangular Family Package |
MO-246I | Aug 2022 |
Designator: PBGA-B#[#]_I0p65...Item: 11.11-1024, Access STP Files for MO-246ICross Reference: N/A Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package |
MO-210Q | Jan 2021 |
Designator: PBGA-B#[#]_I0p... Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO. |
MO-187-F | Sep 2010 |
Item 11.11-832 Free download. Registration or login required. |