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Displaying 1 - 10 of 14 documents. Show 5 | 10 results per page.

Title	Document #	Date
Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.	MO-208-C	Nov 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Matrix Tray for Shipping and Handling of Ball Grid Packages. Includes Change to Note 18. Item 11.5-633	CO-029-H	Sep 2002
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.	MO-249-A	Jan 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Thin Small Outline Package, TSOP - Type 2.	DG-4.15B	May 2004
Item 11.2-675(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Matrix Tray for Advanced Memory Buffer. Item 11.5-736.	CO-035A	Mar 2006
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.	MO-195-D	May 2006
Item 11.11-704 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)	MS-024H	Jun 2006
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.	MO-284-A	May 2007
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.

Registration - Thin Matrix Tray for Shipping and Handling of Ball Grid Packages. Includes Change to Note 18. Item 11.5-633

Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.

Design Requirements - Thin Small Outline Package, TSOP - Type 2.

48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.

Registration - Thin Matrix Tray for Advanced Memory Buffer. Item 11.5-736.

Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.

Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)

Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.

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