Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 5 of 7 documents. Show 5 results per page.
| Title | Document # |
Date |
|---|---|---|
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412 |
MO-232-A | Aug 2001 |
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Free download. Registration or login required. |
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Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.This document is being removed based on decission by the Chair under directive from the BoD, letter is attached |
MO-220-D | Feb 2002 |
This registration has been removed. Please 'open file' for more information regarding this issue. Free download. Registration or login required. |
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Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638. |
MO-245-A | Sep 2003 |
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Free download. Registration or login required. |
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Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679. |
MO-250-A | Nov 2003 |
|
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN. |
MO-265-A | Nov 2005 |
Item 11.11-722 Free download. Registration or login required. |
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