Global Standards for the Microelectronics Industry
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Displaying 6 - 7 of 7 documents. Show 5 results per page.
| Title | Document # |
Date |
|---|---|---|
Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680 |
MO-239-B | Nov 2002 |
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Free download. Registration or login required. |
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Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.This document is being removed based on decission by the Chair under directive from the BoD, letter is attached |
MO-220-D | Feb 2002 |
This registration has been removed. Please 'open file' for more information regarding this issue. Free download. Registration or login required. |
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