Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 2 of 2 documents.
| Title | Document # | Date |
|---|---|---|
EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS: |
JESD51- 5 | Feb 1999 |
This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing thermal test boards with application to these package types. This document is in addition to and not replacement for the design specifications in other standards. Committee(s): JC-15.1 Free download. Registration or login required. |
||
TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT: |
JESD51-11 | Jun 2001 |
This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families. Committee(s): JC-15.1 Free download. Registration or login required. |
||
