Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # | Date |
|---|---|---|
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING – REPORTING ESD WITHSTAND LEVELS ON DATASHEETS |
JEP178 | Apr 2021 |
This document is intended to guide device manufacturers in developing datasheets and to device customers in understanding datasheet entries. Committee(s): JC-14.3 Free download. Registration or login required. |
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COPY-EXACT PROCESS FOR MANUFACTURING |
JEP185 | Aug 2021 |
This publication defines the requirements for Copy-Exact Process (CEP) matching, real-time process control, monitoring, and ongoing assessment of the CEP. The critical element requirements for inputs, process controls, procedures, process indicators, human factors, equipment/infrastructure and matching outputs are given. Manufacturers, suppliers and their customers may use these methods to define requirements for process transfer within the constraints of their business agreements. Committee(s): JC-14.3 Free download. Registration or login required. |
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Guideline to Specify a Transient Off-State Withstand Voltage Robustness Indicator in Datasheets for Lateral GaN Power Conversion Devices, Version 1.0 |
JEP186 | Dec 2021 |
This guideline describes different techniques for specifying a Transient Off-state Withstand Voltage Robustness Indicator in datasheets for lateral GaN power conversion devices. This guideline does not convey preferences for any of the specification types presented, nor does the guideline address formatting of datasheets. This guideline does not indicate nor require that the datasheet parameters are used in production tests, nor specify how the values were obtained. Committee(s): JC-70.1 Free download. Registration or login required. |
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Guidelines for Representing Switching Losses of SIC MOSFETs in Datasheets |
JEP187 | Dec 2021 |
This document describes the impact of measurement and/or setup parameters on switching losses of power semiconductor switches; focusing primarily on SiC MOSFET turn-on losses. In terms of turn-off losses, the behavior of SiC MOSFETs is similar to that of existing silicon based power MOSFETs, and as such are adequately represented in typical datasheets. Committee(s): JC-70.2 Free download. Registration or login required. |
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ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema |
JEP181_Schema_R2p0 | Nov 2023 |
In conjunction with JEP181A, for user support this file is the entire “XML Requirements Schema”. Committee(s): JC-15 Free download. Registration or login required. |
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Guideline for Evaluating dv/dt Robustness of SiC Power Devices, Version 1.0 |
JEP190 | Aug 2022 |
This document provides stress procedures, general failure criteria and documentation guidelines such that the dv/dt robustness can be demonstrated, evaluated and documented. This document gives examples for test setups which can be used and the corresponding test conditions. Additionally, criteria are explained under which device manufacturers can select an appropriate test setup. Committee(s): JC-70.2 Free download. Registration or login required. |
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SYSTEM LEVEL ESD Part III: Review of ESD Testing and Impact on System-Efficient ESD Design (SEED) |
JEP164 | Oct 2022 |
This white paper presents the recent knowledge of system ESD field events and air discharge testing methods. Testing experience with the IEC 61000-4-2 (2008) and the ISO 10605 ESD standards has shown a range of differing interpretations of the test method and its scope. This often results in misapplication of the test method and a high test result uncertainty. This white paper aims to explain the problems observed and to suggest improvements to the ESD test standard and to enable a correlation with a SEED IC/PCB co-design methodology. Committee(s): JC-14.3 Free download. Registration or login required. |
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Survey On Latch-Up Testing Practices and Recommendations for Improvements |
JEP193 | Jan 2023 |
This is a re-publication of a white paper which reports on a survey that has been conducted to better understand how the latch-up standard JESD78 revision E (JESD78E) is interpreted and has been used in the industry. Free download. Registration or login required. |
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Guidelines for Gate Charge (QG) Test Method for SiC MOSFET |
JEP192 | Jan 2023 |
This publication defines a QGS, TOT, QGD and QGS, TH which can be extracted from a measured QG waveform for SiC MOSFETs. Free download. Registration or login required. |
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Guideline for Gate Oxide Reliability and Robustness Evaluation Procedures for Silicon Carbide Power MOSFETs |
JEP194 | Feb 2023 |
This document provides guidelines for evaluating gate reliability and lifetime testing for silicon carbide (SiC) based power devices with a gate oxide or gate dielectric. Free download. Registration or login required. |
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Guideline for Evaluating Gate Switching Instability of Silicon Carbide Metal-Oxide-Semiconductor Devices for Power Electronic Conversion |
JEP195 | Feb 2023 |
This document elaborates on the information given in JEP184 regarding the long-time stability of device parameters under static conditions and under application near switching conditions. Free download. Registration or login required. |
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Part Model Guidelines for Electronic-Device Packages – XML Requirements |
JEP30E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-A100B | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required. |
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Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-P100E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100B | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required. |
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Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-S100A | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces |
JEP196 | Nov 2023 |
This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces. Free download. Registration or login required. |
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Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices |
JEP197 | Nov 2023 |
This publication provides guidance to SiC product suppliers and related power electronic industries in their evaluation of bipolar degradation mechanism in SiC power devices. Free download. Registration or login required. |
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Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices |
JEP198 | Nov 2023 |
This publication presents guidelines for evaluating the Time Dependent Breakdown (TDB) reliability of GaN power switches. Free download. Registration or login required. |
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