Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
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WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)Status: SupersededAugust 2016 (11.2-924) |
SPP-020A | Jul 2003 |
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 Free download. Registration or login required. |
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Word Wide DRAM |
DRAM3.9.4 | Jul 2000 |
Release No. 10 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide EPROM |
EPROM3.4.2 | Jun 1999 |
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide Graphics DRAM |
MPDRAM3.10.3 | Jan 2004 |
Release No.13 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide PROM, DIP to SO Conversion |
PROM3.3.3-4 | Dec 1993 |
Release No.1 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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