Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
---|---|---|
Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-S100A.02 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
||
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100G | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required. |
||
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-A100B.01 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
||
Descriptive Designation System for Electronic-device Packages and Footprints |
JESD30O | Feb 2025 |
This standard establishes requirements for the generation of electronic-device package designators for JEDEC. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE |
MS-012H | Feb 2025 |
Designator: PDSO-G#_I127-##... Item 11-1061 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP) |
MO-366A | Feb 2025 |
Designator: PBGA-B#[#]_I0p35... Item: 11-1075
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
PMIC5000/PMIC5010 Power Management IC Standard |
JESD301-1A.03 | Feb 2025 |
This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5000, PMIC5010 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5000, PMIC5010 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This is a minor update to correct the document name, and also remove the extraneous hard return in the middle of the description between “as” and “used”. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40.1 Free download. Registration or login required. |
||
PLASTIC DUAL SMALL OUTLINE, 1.27 MM PITCH, 7.50 MM BODY WIDTH, RECT FAMILY PACKAGE |
MS-013H | Feb 2025 |
Designator: PDSO-G#-I1p27... Item 11-1062 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card E AnnexRelease Number: Version 2.00 |
JESD305-R8-RCE | Feb 2025 |
This standard, JESD305-R8-RCE, DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card E Annex, defines the design detail of x8, 2 Package Rank DDR5 RDIMM with 8-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Registered Dual Inline Memory Module (RDIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE |
MO-203E | Jan 2025 |
Item 11-1072 Package Designator: PDSO-G#_... A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
PLASTIC DUAL FLATPACK, FLAT TERMINAL, RECTANGULAR FAMILY PACKAGE |
MO-293C | Jan 2025 |
Item 11-1071 PDFP-_... A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
Automotive Solid State Drive (SSD) Device StandardRelease Number: 1.1 |
JESD312 | Jan 2025 |
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features for a solid state drive (SSD) targeted primarily at automotive applications. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
Guidelines for Representing Threshold Voltage of SiC MOSFETs in Datasheets, Version 1.0Release Number: Version 1.0 |
JEP202 | Jan 2025 |
This publication provides guidelines for representation of threshold voltage and transfer characteristic of SiC MOS device in datasheets. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE |
MO-365A | Jan 2025 |
Designator: PBGA-B#[#]_i0P35... Item: 11-1076
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |
||
Universal Flash Storage (UFS)Release Number: Version 4.1 |
JESD220G | Dec 2024 |
This document replaces all prior versions; however, JESD220F August 2022 (version 4.0) remains available for reference purposes. This standard defines a UFS Universal Flash Storage electrical interface and a UFS memory device. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Available for purchase: $423.00 Add to Cart Paying JEDEC Members may login for free access. |
||
Universal Flash Storage Host Controller Interface (UFSHCI)Release Number: Version 4.1 |
JESD223F | Dec 2024 |
This document replaces all prior versions; however, JESD223E August 2022 (version 4.0) remains available for reference purposes. This standard describes a functional specification of the Host Controller Interface (HCI) for Universal Flash Storage (UFS). The objective of UFSHCI is to provide a uniform interface method of accessing the UFS hardware capabilities so that a standard/common Driver can be provided for the Host Controller. The common Driver would work with UFS host controller from any vendor. This standard includes a description of the hardware/software interface between system software and the host controller hardware. It is intended for hardware designers, system builders and software developers. This standard is a companion document to [UFS], Universal Flash Storage (UFS). The reader is assumed to be familiar with [UFS], [MIPI-UNIPRO], and [MIPI-M-PHY]. Clause 4 provides a brief overview of the architectural overview of UFS. Clause 5 describes the register interface of UFSHCI. Clause 6 describes the data structure used by UFSHCI. Clause 7 provides a theory of operation for UFSHCI. Clause 8 describes the error recovery process for UFSHCI. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Available for purchase: $220.00 Add to Cart Paying JEDEC Members may login for free access. |
||
DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card C AnnexRelease Number: Version 1.00 |
JESD323-A0-RCC | Dec 2024 |
This standard, “JESD323-A0-RCC, “DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card C Annex” defines the design detail of x16, 1 Package Ranks DDR5 Clocked UDIMM. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY |
MO-357D | Nov 2024 |
Designator: XBMA-H736_I1p0_R78p0x23p0Z2p6 Item #: 11.14-232 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT) |
SO-032D | Nov 2024 |
Designator: SO-032D_PDUtBXC-H736_I1p0-R17p15x78p0Z1p05 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
DDR5 DIMM Labels |
JESD401-5C | Nov 2024 |
This standard defines the labels that shall be applied to all DDR5 memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format. A readable point size should be used, and the number can be printed in one or more rows on the label. Hyphens may be dropped when lines are split, or when font changes sufficiently. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 Free download. Registration or login required. |
||
Compression Attached Memory Module (CAMM2) Common Standard |
JESD318A Ver. 1.10 | Nov 2024 |
This standard defines the electrical and mechanical requirements for Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LP5 SDRAM CAMM2s). A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 Free download. Registration or login required. |
||
LPDDR5/5X Compression Attached Memory Module (CAMM2) Raw Card E AnnexRelease Number: Version 1.00 |
JESD318-F0-RCE | Nov 2024 |
This standard, JESD318-F0-RCE, “LPDDR5/5X Compression Attached Memory Module (CAMM2) Raw Card E Annex”, defines the design detail of eight x16 subchannels from four 315-ball dual channel LPDDR5/5x devices. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 Free download. Registration or login required. |
||
DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Raw Card A AnnexRelease Number: Version 1.00 |
JESD324-V0-RCA | Nov 2024 |
This standard, JESD324-V0-RCA, “DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Raw Card A Annex” defines the design detail of x8, 1 Package Ranks DDR5 CSODIMM with Clock Driver. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
DDR5 Clocked Unbuffered Dual Inline Memory Module with 4-bit ECCRelease Number: Version 1.00 |
JESD323-B4-RCD | Nov 2024 |
This standard, JESD323-B4-RCD, “DDR5 Clocked Unbuffered Dual Inline Memory Module with 4-bit ECC (EC4 CUDIMM) Raw Card D Annex” defines the design detail of x8, 1 Package Rank DDR5 ECC CUDIMM with Clock Driver. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A AnnexRelease Number: Version 1.00 |
JESD323-A0-RCA | Nov 2024 |
This standard, JESD323-A0-RCA, “DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A Annex” defines the design detail of x8, 1 Package Rank DDR5 NECC CUDIMM with Clock Driver. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. |
||
DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A AnnexRelease Number: Version 1.00 |
JESD323-A0-RCA | Nov 2024 |
This standard, JESD323-A0-RCA, “DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A Annex” defines the design detail of x8, 1 Package Rank DDR5 NECC CUDIMM with Clock Driver. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
DDR5 Clocked Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 CSODIMM) Raw Card D AnnexRelease Number: Version 1.00 |
JESD324-W4-RCD | Nov 2024 |
This standard, JESD324-W4-RCD, “DDR5 Clocked Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 CSODIMM) Raw Card D Annex” defines the design detail of x8, 1 Package Ranks DDR5 CSODIMM with Clock Driver. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.3 Free download. Registration or login required. |
||
DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Raw Card C AnnexRelease Number: Version 1.00 |
JESD324-V0-RCC | Nov 2024 |
This standard, JESD324-V0-RCC, "DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) RawCard C Annex" defines the design detail of x16, 1 Package Ranks DDR5 CSODIMM with Clock Driver. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.3 Free download. Registration or login required. |
||
Serial Flash Discoverable Parameters (SFDP) |
JESD216G | Nov 2024 |
The SFDP standard defines the structure of the SFDP database within the memory device and methods used to read its data. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42.4 Free download. Registration or login required. |
||
Low Power Double Data Rate Interface for Non-Volatile Memory (LPDDR4X-NVM) Standard |
JESD326-4 | Nov 2024 |
This standard defines the Low Power Double Data Rate interface for Non-Volatile Memory (LPDDR4XNVM) Standard. This standard describes features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a JEDEC compliant 16 bit single channel LPDDR4X-NVM device. LPDDR4X-NVM density ranges from 128Mb through 32Gb. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
LPDDR5/5X Serial Presence Detect (SPD) ContentsRelease Number: 1.0 |
JESD406-5A | Nov 2024 |
This publication describes the serial presence detect (SPD) values for all LPDDR5/5X memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be use by the system's BIOS in order to properly initialize and optimize the system memory channels. The storage capacity of the SPD non-volatile memory is limited, so a number of techniques are employed to optimize the use of these bytes, including overlays and run length limited coding. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 Free download. Registration or login required. |
||
JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - DEVICE LEVEL |
JS-001-2024 | Oct 2024 |
This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. NOTE Data previously generated with testers meeting all waveform criteria of ANSI/ESD STM5.1-2007 or JESD22A-114F shall be considered valid test data. Also available JTR-001-01-12: User Guide of ANSI/ESDA/JEDEC JS-001, Human Body Model Testing of Integrated Circuits A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
NAND Flash Interface Interoperability |
JESD230G | Oct 2024 |
This standard was jointly developed by JEDEC and the Open NAND Flash Interface Workgroup, hereafter referred to as ONFI. This standard defines a standard NAND flash device interface interoperability standard that provides means for system be designed that can support Asynchronous SDR, Synchronous DDR and Toggle DDR NAND flash devices that are interoperable between JEDEC and ONFI member implementations. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
DDR5 262 Pin SODIMM Connector Performance Standard |
PS-006B | Sep 2024 |
This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 14-226 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
Wire Bond Pull Test Methods |
JESD22-B120.01 | Sep 2024 |
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
JEDEC® Memory Controller Standard – for Compute Express Link® (CXL®) |
JESD319 | Sep 2024 |
This standard defines the overall specifications, interface parameters, signaling protocols, and features for a CXL® Memory Controller ASIC. The standard includes pinout information, functional description, and configuration interface. This standard, along with other Referenced Specifications, should be treated as a whole for the purposes of defining overall functionality for CXL® Memory Controller (referred to as CMC). A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40 Free download. Registration or login required. |
||
PLASTIC DUAL SMALL OUTLINE, GULL WING, 0.95 MM PITCH, RECT PACKAGE (TRANSISTOR) |
TO-236-I | Sep 2024 |
Item #: 11-1067 Package Designator: PDSO-G3(6)-i0p95.... A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |
||
JEDEC® Memory Device Management Standard – for Compute Express Link® (CXL®) |
JESD325 | Sep 2024 |
This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. It is intended to target, but may not be limited to, CXL memory FRUs that are based on PCIe Gen 5 and compliant to the CXL 2.0 Specification or later. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
||
DDR5 SERIAL PRESENCE DETECT (SPD) CONTENTSRelease Number: Release 1.3 |
JESD400-5C | Sep 2024 |
This standard describes the serial presence detect (SPD) values for all DDR5 memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be use by the system's BIOS in order to properly initialize and optimize the system memory channels. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 Free download. Registration or login required. |
||
Temperature Range and Measurement Standards for Components and Modules |
JESD402-1B | Sep 2024 |
This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42 Free download. Registration or login required. |