Standards & Documents Search

This download includes all files under the parent schema JEP30-10v6-0-0 (Committees: JC-11, JC-11.2) including:

• JEP30-A101v2-0-3 (Assembly Process),
  
  • Committees: JC-11, JC-11.2, JC-14
• JEP30-E101v4-0-0 (Electrical),
  
  • Committees: JC-11, JC-11.2, JC-16
• JEP30-P101v6-0-0 (Package),
  
  • Committees: JC-11, JC-11.2
• JEP30-S101v1-0-3 (Supply Chain),
  
  • Committees: JC-11, JC-11.2, JC-14
• JEP30-T101v2-0-3 (Thermal)
  
  • Committees: JC-11, JC-11.2, JC-15
• JEP30-D10v4-0-1 (Types Dictionary)
  
  • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

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This guideline is intended to overcome the limitations of prior standards and provide a test circuit and method that provides both reliable and repeatable results.

Committee(s): JC-70, JC-70.2

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The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and  damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.

Committee(s): JC-14, JC-14.1

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The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

Committee(s): JC-14, JC-14.1

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At the request of IPC, J-STD-002B has been removed from the free download area. In its place, JEDEC's Test Method, JESD22-B102, Solderability, which includes lead-free, was made available until it was replaced by J-STD-002D. 

Any revision to J-STD-002 will no longer be available for free to the industry on the JEDEC website. However, the document is available to the JEDEC formulating Committee members, in the Members Area. 

If you are not a JEDEC member you may wish to try the IPC website or one of the resellers listed at: http://www.jedec.org/standards-document

Committee(s): JC-13, JC-14.1

This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46.

Committee(s): JC-14.4

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This standard describes the measurement of signal diodes (IF <=500mA dc) reverse recovery times of less than 300 ns duration. It may, however, also be used for the measurement of longer recovery times. This standard is also intended to establish a method which to characterize the test fixture used for this measurement.

Committee(s): JC-22.4

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The purpose of this standard is to classify the output of solar cells for space vehicle service in accordance with requirements of EIA Format JS4-RDF4.

Committee(s): JC-23.1

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One section of this standard presents a thorough explanation of thyristor principals, defining thedifferent classes of these devices, their Physical structure and detailing the numerous test methods and ratings required in their application to electronic and power circuitry. Another section presents a universally accepted listing of letter symbols. Considerable effort is devoted to the use of JEDEC Type Registration System as related to thyristors. This will permit the device manufacturer to employ a uniform procedure in the development of maximum rating and presentation of performance data.

Committee(s): JC-22.1

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