Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # | Date |
|---|---|---|
Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272. |
MS-015-A | |
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Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241. |
MS-016-A | |
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Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S. |
MS-018-A | |
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Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315. |
MS-017-B | |
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Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-290S. |
MS-019-B | |
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Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S. |
MS-021-A | |
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Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T. Item 11.11-291S |
MS-020-B | |
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Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S. |
MS-023-A | |
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Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S. |
MS-022-B | |
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Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S |
MS-025-B | |
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