Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
Title | Document # | Date |
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MARKING PERMANENCYStatus: Reaffirmed August 2024 |
JESD22-B107D | Mar 2011 |
This test method provides two tests for determining the marking permanency of ink marked integrated circuits. A new non-destructive tape test method is introduced to quickly determine marking integrity. The test method also specifies a resistance to solvents method based upon MIL Std 883 Method 2015. Free download. Registration or login required. |
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Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665. |
MO-149-F | Oct 2003 |
Committee(s): JC-11.11, JC-11.4 Free download. Registration or login required. |