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Title Document # Date

Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.

 MO-149-F Oct 2003

Committee(s): JC-11.11, JC-11.4

JEP95 Registrations Main Page

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MARKING PERMANENCY

Status: Reaffirmed August 2024 		JESD22-B107D Mar 2011

This test method provides two tests for determining the marking permanency of ink marked integrated circuits. A new non-destructive tape test method is introduced to quickly determine marking integrity. The test method also specifies a resistance to solvents method based upon MIL Std 883 Method 2015.

Committee(s): JC-14, JC-14.1

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