Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
| Title | Document # | Date |
|---|---|---|
Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Devices |
JEP150A | Dec 2023 |
This publication contains frequently recommended and accepted JEDEC reliability stress tests applied to surface-mount solid state devices. Free download. Registration or login required. |
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HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST) |
JESD22-A110E.01 | May 2021 |
The purpose of this test method is to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs severe conditions of temperature, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. This is a minor editorial edit to JESD22A110E, July 2015 approved by the formulating committee. Committee(s): JC-14.1 Free download. Registration or login required. |
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