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RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

Status: Reaffirmed February 2023 		JESD22-B106E Nov 2016

This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Committee(s): JC-14.1

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