Global Standards for the Microelectronics Industry
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Title | Document # | Date |
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IPC/JEDEC-9703: MECHANICAL SHOCK TEST GUIDELINE FOR SOLDER JOINT RELIABILITYStatus: Reaffirmed May 2014, May 2019 |
JS9703 | Mar 2009 |
This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level. Committee(s): JC-14.1 Free download. Registration or login required. |