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Title Document # Date

SOLDER BALL SHEAR

Status: Reaffirmed September 2020 		JESD22-B117B May 2014

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

Committee(s): JC-14, JC-14.1

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SOLDER BALL PULL

Status: Reaffirmed September 2021 		JESD22-B115A.01 Jul 2016

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document. This is a minor editorial revision to JESD22-A115A.

Committee(s): JC-14, JC-14.1

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