Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2. |
DO-221B | Aug 2018 |
Item 11.10-455. Free download. Registration or login required. |
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Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439. |
DO-222A | May 2006 |
Free download. Registration or login required. |
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Registration - Thin Matrix Tray for Handling and Shipping Small Outline J- Lead Packages (SOJ). Item 11.5-446. |
CO-032-A | Jun 1996 |
Free download. Registration or login required. |
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Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package |
MS-012G.02 | Sep 2020 |
Designator: PDSO-G#_I127-##... Item 11.11-972(E), Minor editorial correction. Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668. |
MO-249-A | Jan 2004 |
Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678. |
MO-255-B | Oct 2005 |
Free download. Registration or login required. |
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Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E). |
TO-278B | Nov 2006 |
Patents(): STMicroelectronics Inc. Free download. Registration or login required. |
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Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436 |
TO-277A | Jan 2006 |
Free download. Registration or login required. |
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Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP. |
MO-272-A | May 2006 |
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON. |
MO-252D | Mar 2010 |
Item 11.11-830. Free download. Registration or login required. |
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Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO. |
MO-187-F | Sep 2010 |
Item 11.11-832 Free download. Registration or login required. |
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Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline. |
SO-008B | Oct 2012 |
Item 11.14-141 Free download. Registration or login required. |
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Registration - Plastic Small Outline Package with Exposed Heat Sink. |
MO-230-A | Mar 2001 |
Item 11.11-574 Committee(s): JC-11.11 Free download. Registration or login required. |
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204-Pin DDR3 SDRAM Unbuffered SODIMM Design Specification |
MODULE4.20.18 | May 2014 |
Release No. 24; Item 2114.44 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family |
MS-013G | Oct 2020 |
Designator: PDSO-G#-I1p27... Item 11.11-967(S). Committee(s): JC-11.11 Free download. Registration or login required. |
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Annex C, R/C C, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design SpecificationRelease Number: 30 |
MODULE4.20.25.C | May 2020 |
This annex defines the electrical and mechanical requirements for Raw Card C, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SODIMMs). These DDR4 SODIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item 2228.31B Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |