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Displaying 1 - 5 of 17 documents. Show 5 | 10 results per page.

Title	Document #	Date
Registration - Small Outline Plastic Surface Mount Package with 2 Gullwing Terminals. Includes Errata to DO-215, May 1998. Item 11.1-655(e).	DO-215-D	Apr 2003
Committee(s): JC-11.10, JC-11.1 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)	MS-024H	Jun 2006
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Plastic Surface Mount. PSOF-2. Item 10-431.	DO-220-B	Oct 2004
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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