Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 4 of 4 documents.
Title![]() |
Document # | Date |
---|---|---|
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S) |
MS-024H | Jun 2006 |
Committee(s): JC-11.11 Free download. Registration or login required. |
||
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP. |
MO-271-A | Jun 2006 |
Item 11.11-738 Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO. |
MO-286B | Jan 2015 |
Item 11.10-450 Committee(s): JC-11.10 Free download. Registration or login required. |
||
Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC. |
MO-137E | Mar 2010 |
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Free download. Registration or login required. |