Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 2 of 2 documents.
Title |
Document # | Date |
|---|---|---|
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S) |
MS-024H | Jun 2006 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Design Requirements - Thin Small Outline Package, TSOP - Type 2. |
DG-4.15B | May 2004 |
Item 11.2-675(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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