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Title	Document #	Date
SOLDER BALL SHEAR Status: Reaffirmed September 2020	JESD22-B117B	May 2014
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

Title

Document #

Date

SOLDER BALL SHEAR

Status: Reaffirmed September 2020

JESD22-B117B

May 2014

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

Committee(s): JC-14, JC-14.1

Free download. Registration or login required.

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SOLDER BALL SHEAR

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