Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 4 of 4 documents.
Title | Document # | Date |
---|---|---|
FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORINGStatus: Reaffirmed June 2011, May 2022 |
JESD659C | Apr 2017 |
This method establishes requirements for application of Statistical Reliability Monitoring 'SRM' technology to monitor and improve the reliability of electronic components and subassemblies. The standard also describes the condition under with a monitor may be replaced or eliminated. Formerly known as EIA-659, that superseded JESD29-A (July 1996). Became JESD659 after revision, September 1999. Free download. Registration or login required. |
||
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES |
JESD31F | Aug 2021 |
This standard identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged or in wafer/die form, manufactured by all Manufacturers. The requirements defined within this document are only applicable to products for which ownership remains with the Distributor or Manufacturer. Free download. Registration or login required. |
||
TEMPERATURE, BIAS, AND OPERATING LIFE |
JESD22-A108G | Nov 2022 |
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. Free download. Registration or login required. |
||
Wire Bond Pull Test Methods |
JESD22-B120.01 | Sep 2024 |
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Free download. Registration or login required. |