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Displaying 1 - 4 of 4 documents.

Title	Document #	Date
TEMPERATURE, BIAS, AND OPERATING LIFE	JESD22-A108G	Nov 2022
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING Status: Reaffirmed June 2011, May 2022	JESD659C	Apr 2017
This method establishes requirements for application of Statistical Reliability Monitoring 'SRM' technology to monitor and improve the reliability of electronic components and subassemblies. The standard also describes the condition under with a monitor may be replaced or eliminated. Formerly known as EIA-659, that superseded JESD29-A (July 1996). Became JESD659 after revision, September 1999. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES	JESD31F	Aug 2021
This standard identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged or in wafer/die form, manufactured by all Manufacturers. The requirements defined within this document are only applicable to products for which ownership remains with the Distributor or Manufacturer. Committee(s): JC-13, JC-14.4 Free download. Registration or login required.
Wire Bond Pull Test Methods	JESD22-B120.01	Sep 2024
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.