Global Standards for the Microelectronics Industry
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| Title | Document # | Date |
|---|---|---|
Temperature Cycling |
JESD22-A104F.01 | Apr 2023 |
This standard applies to single-, dual- and triple-chamber temperature cycling in an air or other gaseous medium and covers component and solder interconnection testing. Committee(s): JC-14.1 Free download. Registration or login required. |
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