Standards & Documents Search

Displaying 1 - 6 of 6 documents. Show 5 results per page.

Title	Document #	Date
SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES	JEP143D	Jan 2019
The purpose of this publication is to provide an overview of some of the most commonly used systems and test methods historically performed by manufacturers to assess and qualify the reliability of solid state products. The appropriate references to existing and proposed JEDEC (or EIA) standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENT Status: Reaffirmed September 2019	JEP148B	Jan 2014
A concept is outlined, which proactively integrates qualification into the development process and provides a systematic procedure as support tool to development and gives early focus on required activities. It converts requirements for a product into measures of development and qualification in combination with a risk and opportunity assessment step and accompanies the development process as guiding and recording tool for advanced quality planning and confirmation. The collected data enlarge the knowledge database for DFR / BIR (design for reliability / building-in reliability) to be used for future projects. The procedure challenges and promotes teamwork of all involved disciplines. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
ALPHA RADIATION MEASUREMENT IN ELECTRONIC MATERIALS	JESD221	May 2011
This standard applies generally to gas proportional instruments and the use thereof in measuring materials with an alpha emissivity of less than 10 a·khr^-1·cm^-2. The primary focus will be on materials used in semiconductor fabrication. The purpose of this document is to specify the recommended method for measuring alpha emissivity in materials utilized in the manufacturing of semiconductors. The method specifically applies to gas proportional instruments and designates recommended instrument settings. In addition, the method discusses operation of ionization counters. The document also recommends methods for determining sample size and for evaluating instrument background accurately. Committee(s): JC-13, JC-13.4 Free download. Registration or login required.
GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING: Status: ReaffirmedOctober 2012	JEP139	Dec 2000
This document describes a constant temperature (isothermal) aging method for testing aluminum (Al) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding. This method is valid for metallization/dielectric systems in which the dielectric is deposited onto the metallization at a temperature considerably above the intended use temperature, and above or equal to the deposition temperature of the metal. Although this is a wafer test, it is not a fast (less than 5 minutes per probe) test. It is intended to be used for lifetime prediction and failure analysis, not for production Go-NoGo lot checking. Committee(s): JC-14.2 Free download. Registration or login required.
ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST	JESD22-A118B.01	May 2021
The Unbiased HAST is performed for the purpose of evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under noncondensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors that pass through it. Bias is not applied in this test to ensure the failure mechanisms potentially overshadowed by bias can be uncovered (e.g., galvanic corrosion). This test is used to identify failure mechanisms internal to the package and is destructive. Committee(s): JC-14.1 Free download. Registration or login required.
Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors	JEP199	Apr 2024
This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors. Committee(s): JC-14, JC-14.2 Free download. Registration or login required.