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Title Document # Date

A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces

 JEP196 Nov 2023

This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces.

Committee(s): JC-14, JC-14.3

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Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors

 JEP199 Apr 2024

This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors.

Committee(s): JC-14, JC-14.2

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