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Title Document # Date

Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.

 MO-251-A Feb 2004

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

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Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.

 MO-255-B Oct 2005

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB.

 MO-243-A Jul 2003

Item 11.11-661

Patents(): Amkor, ASAT, National Semiconductor: See Outline

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

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