Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN) |
DG-4.24B | Aug 2016 |
Item 11.2-850(S) Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN. |
MO-296B | Jan 2012 |
Item 11.11-849 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN. |
MO-220-K.01 | Aug 2011 |
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP. |
MO-292C | Apr 2010 |
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |