Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N. |
DG-4.8C | Sep 2006 |
Item 11.2-713(s) Free download. Registration or login required. |
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Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN. |
DG-4.23A | Nov 2005 |
Item 11.2-728(S) Free download. Registration or login required. |
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Design Requirements - Quad Flatpack |
DG-4.4A | Jun 2000 |
Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN. |
DG-4.19D | May 2007 |
Item 11.2-765(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN) |
DG-4.24B | Aug 2016 |
Item 11.2-850(S) Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317. |
MO-134-A | May 1992 |
Patents(): National Semiconductor: 4,796,080 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.This document is being removed based on decission by the Chair under directive from the BoD, letter is attached |
MO-220-D | Feb 2002 |
This registration has been removed. Please 'open file' for more information regarding this issue. Free download. Registration or login required. |
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Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP. |
MO-148-A | Jun 1993 |
Item 11.10-334 Free download. Registration or login required. |
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Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679. |
MO-250-A | Nov 2003 |
Free download. Registration or login required. |
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Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707. |
MO-257-B | May 2005 |
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Free download. Registration or login required. |
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Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599. |
MO-208-C | Nov 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN. |
MO-267-B | Feb 2006 |
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN. |
MO-296B | Jan 2012 |
Item 11.11-849 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |
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Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP. |
MO-248-E | Jun 2006 |
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN. |
MO-220-K.01 | Aug 2011 |
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN. |
MO-265-A | Nov 2005 |
Item 11.11-722 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP. |
MO-292C | Apr 2010 |
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 Free download. Registration or login required. |